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          Condition monitoring module

          Condition monitoring module system integrated circuits and reference designs

          Description

          Our integrated circuits and reference designs enable designers to build condition monitoring module applications with a high-speed signal chain, powerful processing and different wired and wireless interfaces to connect to the external world.

          Condition monitoring module designs often require:

          • High-resolution, high-speed conversion with low-power vibration front end
          • Efficient scalable FFT processing to predict potential machine failures
          • Edge processing to reduce system power and lower network bandwidth
          View more

          Technical documents

          Application notes & user guides

          Application Notes (3)

          Title Type Size (KB) Date
          PDF 128 KB 12 Mar 2019
          PDF 386 KB 22 Jun 2018
          PDF 506 KB 18 Sep 2017

          Product bulletin & white papers

          White Papers (1)

          Title Type Size (MB) Date
          PDF 1.73 MB 02 Nov 2016

          Technical articles

          Support & training

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          Content is provided 'AS IS' by the respective TI and Community contributors and does not constitute TI specifications.
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